Nvidia signs a $1.5 billion agreement with Amkor Technology to expand advanced semiconductor packaging and testing capacity in the United States. Multiple outlets report that the deal involves a large prepayment and is intended to strengthen and tighten Nvidia’s supply chain for the production stages that follow chip design, which are closely linked to delivering components used in Nvidia’s data-centre products. The agreement is announced on 23 July. Bloomberg describes it as part of a broader effort to build out semiconductor operations in the US, while The Next Web adds that Amkor’s expansion focuses on advanced packaging and testing and notes that Amkor shares rise in after-hours trading following the announcement. Channel NewsAsia and Yahoo Finance also describe the same $1.5 billion chip packaging deal between the two companies. Across the coverage, the core elements are consistent: the parties, the size of the commitment, and the purpose of increasing US-based packaging and testing capacity to support semiconductor supply needs.