Samsung Electronics and Broadcom sign a memorandum of understanding worth more than $200 billion for chip supply and related manufacturing services. Multiple reports say the agreement covers a broad set of technologies needed for AI semiconductors, including memory chips, foundry manufacturing, and advanced packaging, and it runs for about five years through 2030. Fortune and other outlets also link the partnership to Samsung’s next-generation process technology, including 2-nanometer and below manufacturing, to support Broadcom’s product roadmap.
Several sources add that the deal includes high-bandwidth memory (HBM) and highlights Samsung’s 2-nanometer foundry capacity alongside advanced packaging capabilities. The reports describe the contract as part of both companies’ efforts to expand their roles in the AI infrastructure supply chain, where demand for specialized chips and manufacturing capacity continues to increase.
The agreement is described as a significant step for Samsung’s semiconductor business and for its efforts to compete in leading-edge AI chip manufacturing and packaging. The final commercial details, such as specific volumes and pricing, are not provided in the summarized accounts.
