Samsung Electronics and Broadcom sign a memorandum of understanding worth more than $200 billion for chip-related manufacturing and services, according to multiple reports. The agreement is aimed at expanding capacity for artificial intelligence semiconductor infrastructure as both companies compete for demand in the AI chip supply chain. The deal runs for about five years, through 2030, and is described as covering multiple parts of the production stack. Reports state it includes memory chips, foundry manufacturing, and advanced packaging, which is often used to connect and integrate AI processors and memory components. One outlet frames the contract as a long-term supply arrangement that strengthens Samsung’s role in supplying key semiconductor components to Broadcom. Another outlet specifies that the announcement occurs at an AI summit in San Francisco and emphasizes the scope across memory, manufacturing, and advanced packaging for AI semiconductors. The reports do not add detailed financial terms beyond the headline value and do not specify whether the full amount reflects firm orders or a combination of projected supply, but all sources describe the figure as exceeding $200 billion and tied to AI infrastructure demand.