Multiple reports say Apple is dealing with a mobile DRAM shortage ahead of the iPhone 18 Pro lineup and its first foldable iPhone, commonly referred to as the “iPhone Ultra.” Semiconductor analyst Tim Culpan is cited across outlets as saying Apple cannot get enough DRAM in time to complete production packaging for the new A20 Pro chip, which is built on TSMC’s 2nm (N2) process. Because the DRAM needs to be present during wafer-level packaging, completed wafers can pile up at TSMC while waiting for memory chips; one estimate cited is that about $1 billion worth of unpackaged Apple processors are waiting on DRAM.
Apple is reportedly trying to secure DRAM from major suppliers including Micron, SK Hynix, and Samsung, while also exploring additional sourcing options. Sources in the reports say Apple and its assemblers expect they can still meet initial demand, but online orders may see longer wait times and retail inventory could sell out quickly. Potential downstream effects include compressed scheduling for main logic board and final assembly at suppliers such as Foxconn and BYD. The shortage is also linked to broader DRAM constraints attributed in part to increased demand from AI data center spending.
