Google unveils its Pixel 11 series with the Tensor G6 chipset, but a widely shared rumor about the chip’s manufacturing node is proven wrong. Earlier reports claimed the Tensor G6 would be built on TSMC’s 2nm process, potentially making it among the first 2nm smartphone chips.
Multiple outlets report that Google’s VP of Hardware, Peng Yu-Chun, confirms the Tensor G6 is manufactured on TSMC’s 3nm node. NDTV specifically says this confirmation comes from remarks around Google’s “Made by Google” event, where the Pixel 11 lineup is presented. GSMArena notes that Google does not state the process directly in public materials, and that the 3nm detail emerges from the VP’s comments. 9to5Google similarly frames the update as a correction to earlier speculation.
Outlets agree the Tensor G5 from the prior generation is also a 3nm chip, suggesting a process-node consistency for Google’s recent Tensor generations rather than a jump to 2nm. The chipset is positioned as enabling on-device AI features and improved AI performance through its TPU.
