Xiaomi says it will launch the Xiaomi 18 Fold and the Xiaomi Pad 9 Pro Max in China in September. The company presents the foldable as its first device to use the company’s proprietary Xring O3 chipset, with the exact launch date not yet disclosed.
Xiaomi also positions the Pad 9 Pro Max as launching alongside the foldable and using the same Xring O3 chipset. In its communications, the company teases a broader “tri-chip” setup for future devices, describing the Xring O3 SoC accompanied by an Xring O100 AI acceleration chip and an Xring D100 AI chip.
While NDTV and GSMArena both focus on the September timing and the Xring O3 debut, GSMArena adds technical detail, reporting performance figures from AnTuTu V11 for the Xring O3 and outlining its CPU configuration. NDTV emphasizes the chipset’s role as a first for Xiaomi devices and the accompanying AI chips rather than test results.
