SK hynix says it will begin volume production of its next-generation HBM4E memory chips at its Indiana facility in the third quarter of 2029. The company’s chief executive, Kwak Noh-Jung, also says the current global memory shortage is expected to last through the end of 2030.
The planned expansion is described as a major investment in SK hynix’s U.S. operations, with the company citing stronger demand tied to AI chip development. The new chips use high-bandwidth memory (HBM), which is used in AI accelerators and is sought by major customers. SK hynix says the Indiana site is expected to reach annual capacity of “hundreds of thousands of wafers” and become a key HBM production base by 2030, aiming to bring supply closer to companies such as Nvidia, Microsoft, and Alphabet’s Google.
On the demand outlook, SK hynix does not see clear signs of a memory downturn and expects any later easing to be gradual rather than a sharp drop. It also says it is not concerned about the outlook beyond 2030.