TSMC plans to expand its advanced packaging capacity in Taiwan by building three new plants in the Chiayi Science Park. Multiple reports say the projects are located in Phase II of the park, with the facilities expected to support advanced packaging services for semiconductors. The announcements position the Chiayi expansion as part of TSMC’s broader efforts to increase production and meet growing demand for advanced packaging technologies, which are used to improve performance and integration of chips. The reports consistently describe the number of facilities as three and place them specifically in Chiayi Science Park’s Phase II, but they provide limited detail beyond the location and purpose. As construction and commissioning progress, TSMC’s additional packaging capacity in Chiayi is expected to strengthen its role in advanced packaging in Taiwan and support continued semiconductor manufacturing activity in the region.