Multiple outlets report that Apple’s thermal engineering team focused on how to keep a folding iPhone, described as the “iPhone Duo,” cool while still meeting a thin hardware design goal. The coverage emphasizes that the hinge area becomes a key part of the cooling approach, because folding structures can complicate heat dissipation and airflow.
One report describes a “clever trick” inside the device’s hinge, suggesting Apple uses the hinge structure to support heat management rather than treating it as a purely mechanical component. Another source frames the iPhone Duo’s cooling choices as part of broader engineering trade-offs: making the phone thin forces additional solutions to handle heat, which then shape where thermal innovations are placed throughout the product.
Both accounts tie the work to Apple leadership in silicon and thermal product design, citing an interview with PCMag. While the outlets differ in emphasis—one highlighting the hinge mechanism and the other mapping engineering decisions across the device—they agree that Apple’s approach targets heat control as a central design constraint for a foldable iPhone.
